Fransesco, Mikola and Umniyati, Yunita and Wolfförster, Christian (2022) SELECTION AND EXECUTION OF A SERIES MEASUREMENTS TO INVESTIGATE THERMAL CONDUCTIVE MATERIALS USE FOR COOLING ELECTRONIC COMPONENTS IN IP65/67 POWER SUPPLY UNIT CONSIDERING THE ASSEMBLY AND COSTS. Bachelor thesis, Swiss German University.

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Abstract

Cooling components inside Power Supply Unit (PSU) is vital to prevent the device from overheating. In the IP65/67 Power Supply Unit, there is another important problem to be solved as the power supply is working underwater and isolated from outer environment. This means there will be no air circulation and the heat are accumulated inside the power supply. The purpose of this thesis work is to design and assemble the cooling system that suits the IP65/67 Power Supply Unit (PSU). The PSU currently experiencing over temperature in a several components inside. By applying heat transfer theory and method, conductive heat transfer method must be applied. The cooling components must be designed to reduce the heat and temperature inside the power supply. The components and materials can be defined through calculation and research. Several materials can be used as thermal conductive materials to help absorb heat and reduce temperature inside the power supply while the device is running. After the calculation and design has finished, the cooling system must be assembled and tested inside the PSU. After obtaining the result, the final components and material must be assembled so the IP65/67 Power Supply Unit (PSU) can run smoothly and will not experience any overheating issues. It is recommended to use the material with a high thermal conductivity and high dielectric strength for safety reasons and better heat conduction.

Item Type:	Thesis (Bachelor)
Subjects:	Q Science > QC Physics > QC271 Temperature measurements
Divisions:	Faculty of Engineering and Information Technology > Department of Mechatronics Engineering
Depositing User:	Mr Arinton Sinaga
Date Deposited:	11 Dec 2024 07:51
Last Modified:	11 Dec 2024 07:51
URI:	http://repository.sgu.ac.id/id/eprint/2719

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